HTC offers various metallized ceramic components, these metallized ceramics are ideal for use within high vacuum, high voltage and high pressure applications. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallize on flat, cylindrical, and complex ceramic bodies. Alumina ceramics are generally used as base material, and tungsten or molybdenum are the typical base coat materials used for metallization.
Ceramic base material: 96% Alumina
Read more about the material properties of alumina in our section on materials.
primary layer: tungsten or molybdenum.
They have a minimum layer thickness of 6 μm and are deposited in a screen printing process with subsequent sintering. Other deposition methods are possible as well, depending on the geometry of the component, such as pad printing or coating.
A defined percentage of glassy material ensures the high bond strength of this base metalization on ceramic. A thin layer of nickel (typically 0.5–5 μm thick) is electrically or chemically (electroless) deposited on the tungsten layer to achieve the required wettability of the solder on the metalization.
Other layer such as gold-plating, copper-plating, tin-plating,etc.. are available.